Devices Fabricated @ IITH

A selection of devices and structures fabricated by students in the NanoX cleanroom, imaged by scanning electron and optical microscopy.

Silicon Photonic Devices
Student: Bipul Biswas · Supervisor: Dr. Naresh Emani
SEM image of a silicon grating coupler
Grating coupler
SEM image of a silicon microring resonator
Microring resonator
SEM image of an etched silicon dielectric slab waveguide
Etched dielectric slab

Silicon photonic devices — microring resonator, grating coupler, and dielectric slab waveguide — fabricated for on-chip photonic integrated circuits.

2D TMDC-based Transistors
Student: Soumya Maiti · Supervisor: Dr. Shubhadeep Bhattacharjee
Optical micrograph close-up of a 2D TMDC-based transistor
Transistor close-up
Optical micrograph of an array of 2D TMDC-based transistors
Transistor array

Optical micrographs of transistors fabricated using two-dimensional transition metal dichalcogenide (TMDC) materials.

Nb–Nb Thermo-compression Bonding
Students: Harsh Mishra, Ullas Pandey, Anjani Kumar · Supervisor: Prof. Shiv Govind Singh
Cross-sectional TEM and EDS elemental mapping of a thermo-compression bonded Nb-Nb interface

Thermo-compression bonding of Nb–Nb interfaces for 3D quantum processor applications. Cross-sectional TEM imaging and EDS elemental mapping reveal the bonding interface and the distribution of niobium (Nb), gold (Au), and oxygen (O) across it.

Lithium Niobate-on-Insulator (LNOI) Mach–Zehnder Modulator
Student: Saurabh Suman · Supervisor: Dr. Naresh Emani
Optical microscope images of a fabricated LNOI Mach-Zehnder Modulator, three panels labelled a, b, c

Optical microscope images of the fabricated Lithium Niobate-on-Insulator (LNOI) Mach–Zehnder Modulator (MZM). (a) Gold (Au) electrodes aligned with the 2.5 µm-wide lithium niobate (LN) optical waveguide. (b) MZM showing the edge-coupling taper, push–pull Ground–Signal–Ground (GSG) electrodes, and electro-optic modulation region — the GSG electrodes have a 60 µm signal electrode and 80 µm ground electrodes, with 150×150 µm² probe pads. (c) MZI showing the Y-splitter and upper and lower interferometer arms.

Micropore for Resistive-Pulse Sensing
Student: Naveen Kumar Kamatchi Ramakrishnan · Supervisor: Prof. Shishir Kumar
SEM image of a micropore in an ultra-thin glass membrane
Micropore
SEM image of a micropore with polystyrene microbeads near the pore
Micropore with microbeads

Micropore fabricated in an ultra-thin glass membrane. SEM images confirm the through-hole and show the interaction and accumulation of polystyrene microbeads near the pore, enabling direct visualization of particle transport through the pore for resistive-pulse sensing applications.

Deep Reactive-Ion Etched (DRIE) Silicon Pillars
Student: Shivansh Sharma · Supervisor: Dr. Yogesh Srivastava
SEM image of a silicon DRIE-etched pillar
Etched silicon pillar
SEM image of sidewall scalloping from silicon DRIE
Sidewall scalloping

SEM images of silicon deep reactive-ion etching (DRIE); etch depth ~12 µm, pillar diameter ~40 µm. The sidewall scalloping characteristic of the Bosch etch process is visible.

Plasmonic Bow-Tie Antennas
Contributor: External User · Affiliation: University of Hyderabad
SEM images of plasmonic bow-tie antenna structures with nanoscale gaps

Plasmonic bow-tie antennas fabricated with a gap of ~220 nm using electron-beam lithography.